80 m2 class 1000 cleanroom with a class 100 gold room. The processing and characterization equipment is located in the class 1000 while the lithography is located in the gold room.

• Two high pressure sputtering systems. One of them has a three-target mechanized arm controlled by computer, enabling the deposition of multilayers. The plasma composition can be controlled by mass flow controllers, and three gases are available: Ar, O2 and H2. Each system has its own rf source operating at 13.56 MHz with power up to 200W. Portable glow discharge optical spectroscopy system for the 200 nm - 1000 nm range.
• Conventional sputtering system with three metallic targets and reverse-sputtering capabilities, designed and manufactured by our group.
• ECR-CVD home-made system, with an Astex 4500 plasma source. The system has been used to deposit Si, H, O and N compounds, in particular a-Si:H(i).
• e-beam evaporator with 4 pockets to deposit multilayers without breaking vacuum (materials available: Pt, Ti, Al, Au, Au-Ge, Ni, Cr, SiO2, etc.).
• RIE system designed and manufactured by our research group.
• Mechanical profilometer (Dektak) and optical profilometer (Wyko).
• Semi-automatic microsoldering station model TPT HB16 (wedge/ball/bump). 
• Ellipsometer (Gaertner) operating at 632.8 nm with fixed incident angle of 70º.
• Contact lithography Karl-Süss MJB-3 with resolution down to 1 µm.
• UV-O3 cleaner model PSDP-UV4T from Novascan.